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[DL Available/GD-OES Analysis and Measurement] Cleaning Evaluation of Plated Substrates

With GD-OES (Glow Discharge Optical Emission Spectroscopy), you can understand the film thickness and concentration of nickel plating. Please also use it for the analysis of other surface treatments.

Glow Discharge Optical Emission Spectrometry (GD-OES) is a method for analyzing the composition of a sample by sputtering atoms from its surface, exciting those atoms into a plasma state, and measuring the resulting emission. In this case, we will introduce the "investigation of substrate cleaning effects before the plating process" using GD-OES. Please take a moment to read the PDF materials. In addition to this case, our company has numerous analytical achievements related to plating. We also conduct various surface analyses, including XPS and Auger, in addition to GD-OES. If you have any questions, please feel free to consult with us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *Other materials are also available. If you request through the inquiry button, we will send them to you.

Company：セイコーフューチャークリエーション
Price：Other

Contract Analysis
Processing Contract
Plating Equipment
Cleaning evaluation

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Evaluation of the cleaning of organic residue remaining after sintering.

We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!

In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean soldering technology, sintering bonding is fundamentally designed for "no-clean" processes. However, the currently mainstream sintering bonding methods are performed under high temperature and high pressure conditions, which can lead to residues generated and adhered during the bonding process that may affect subsequent processes and long-term reliability. Cleaning is one potential solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*